Keysight Technologies and Intel Foundry Collaborate on Advanced AI Packaging Solutions
Santa Rosa, CA – Keysight Technologies has announced a strategic partnership with Intel Foundry to enhance Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a pivotal innovation set to revolutionize high-performance packaging solutions for the AI and data center sectors. This collaboration also aligns with Intel’s 18A process node.
As demands for AI and data center capabilities surge in complexity, ensuring reliable communication between chiplets and 3D integrated circuits (3DICs) has become more critical than ever. The industry is responding with open standards such as Universal Chiplet Interconnect Express™ (UCIe™) and Bunch of Wires (BoW), defining interconnect protocols that enable seamless integration across diverse design platforms in advanced 2.5D/3D packaging.
By adopting these emerging standards and verifying chiplets for compliance, Keysight and Intel Foundry aim to foster interoperability among chiplets, ultimately reducing development costs and accelerating innovation in semiconductor design.Keysight’s Chiplet PHY Designer, tailored for high-speed digital chiplet design, now features advanced simulation capabilities for the UCIe™ 2.0 standard and introduces support for the Open Computer Project’s BoW standard. This system-level chiplet design solution facilitates pre-silicon validation, expediting the journey to tapeout.
Suk Lee, VP & GM of the Ecosystem Technology Office at Intel Foundry, stated, “This collaboration is a pivotal step in advancing high-performance packaging solutions, providing enhanced design flexibility and accelerating innovation for our customers in the AI and data center markets.”
Niels Faché, Vice President and General Manager at Keysight, emphasized the significance of the Chiplet PHY Designer in redefining pre-silicon validation, enabling rapid verification and fostering innovation while minimizing costly design iterations.
This partnership marks a significant advancement in semiconductor technology, poised to meet the next-generation demands of the industry with precision and efficiency.
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